The recent SPIE Photomask Technology + Extreme Ultraviolet Lithography event in Monterey, California, was a great example.
At the same time, all of this is being enabled by advancements in AI chips and algorithms, a virtuous cycle of smarter ...
A recent microelectronics conference drew chips professionals from across the world — a major win for Arizona. Now, it must ...
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TSMC produces first Nvidia Blackwell GPU in the US, but it still has to fly to Taiwan for packaging
The first Nvidia Blackwell GPU has successfully rolled off the production line at TSMC's Fab 21 facility in Phoenix, Arizona, ...
While Intel Foundry has gotten off to a slow start, the explosion in demand for artificial intelligence accelerators and the limited advanced manufacturing capacity available at f ...
Key Points Increased position by 51,967 shares in calendar Q3 2025, with an estimated trade value of $5.50 million based on ...
Nvidia unveiled its first U.S.-made Blackwell chip at TSMC’s Phoenix facility, marking a milestone in American semiconductor ...
According to a recent report from SemiAccurate, Microsoft has chosen Intel Foundry to manufacture its Maia 3 AI chip. The machine learning accelerator, code-named Griffin, is ...
Learn how the Commodore 64 Ultimate revives a computing legend with FPGA hardware and retrofuturistic design. Explore its ...
The M5 chip ushers in a new era of multi-threaded processing power, delivering up to 15% faster performance compared to its ...
Microsoft is reportedly set to use Intel's new 18A or 18A-P process for its next-gen Maia 3 accelerator for AI and future chips depending on the outcome.
BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.
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