Yahoo Finance

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Yahoo Finance

ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology

FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Nasdaq

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Business Wire

Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating ...

TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
Semiconductor Engineering

Electroplating IC Packages

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
New Electronics

ACM Research strengthens FOPLP portfolio with launch of Ultra ECP ap-p Tool

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, has launched the new Panel Electrochemical Plating (Ultra ECP ap-p) tool. This ...
Business Wire

The New Stratus 200 and Stratus 300 Provides Highest Throughput Electrodeposition System with Maximum Wafer Yield

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...
Mena FN

FUJIFILM Dimatix Selects Classone Solstice® Goldprotm Single-Wafer Processing System For Inkjet Printhead Plating

(MENAFN- GlobeNewsWire - Nasdaq) Solstice to perform volume gold electroplating of inkjet printheads used in commercial and industrial applications KALISPELL, Mont., June 17, 2025 (GLOBE NEWSWIRE) -- ...
pv magazine International

Copper-plated heterojunction solar cell with 22.1% efficiency, 0.99 bifaciality factor

An international research group has achieved a 22.1% power conversion efficiency in a bifacial heterojunction crystalline solar cell fabricated through copper (Cu) plating metallization. “We developed ...
Semiconductor Engineering

Interconnect Innovations In High Bandwidth Memory: Part 2

Bump technologies are being pushed beyond what was thought to be their physical and performance limits.
Taiwan News

WLCSP Electroless Plating Market Size Forecast, Projected To Garner Significant Revenues By 2030

Electroless plating is also known as conversion coating or auto-catalytic plating. It is a non-galvanic plating method that involves several simultaneous reactions in aqueous solutions. Electroless ...