Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

With digital twins (virtual replicas of objects or systems) of capacitors, engineers can simulate system-level interactions ...

With the rapid development of electric vehicles (EVs), lithium-ion power battery systems as power sources have received more and more attention. With the continuous increase in battery specific energy ...

The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...

Deep-sea residual oil has been recognized as a significant environmental hazard due to its poor low-temperature fluidity and complex recovery processes necessitating urgent solutions. A segmented ...

Part one of this series, published in the January 2007 issue, discussed how to use linear superposition in the steady-state analysis of multiple heat-source systems. However, linear superposition also ...

Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis ToolsBusiness Wire via ITWeb,KYOTO, Japan, 16 Jun 2026[Murata Manufacturing Co., Ltd.] ...

Frenetic Electronics' updated planar magnetics design and simulation tool addresses thermal constraints and power density ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Murata Manufacturing is collaborating with Synopsys to provide easier access to its component simulation models through ...