BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for ...

Fan-Out Wafer Level Packaging Market is Segmented by Type (High Density Fan-Out Package, Core Fan-Out Package), by Application (CMOS Image Sensor, A Wireless Connection, Logic and Memory Integrated ...

Glass adoption is accelerating from various entry points in high-end performance packaging, including packaging for AI accelerators, HPC, and RF telecom markets, and is building the pillars of a new ...

Recently, semiconductor packaging and testing giant Amkor announced that its advanced packaging and testing facility in ...

TEMPE, Ariz., October 06, 2025--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, ...

Amtech Systems (ASYS) is seeing strong growth from its AI packaging business, even as demand from mature node semiconductor ...

Amkor Technology (AMKR) may not be the flashiest name, but it is a key behind-the-scenes part of the global chip industry.

A new semiconductor manufacturing plant broke ground in Peoria this week. Amkor’s $7 billion facility will reportedly be one of the largest chip packaging plants in the country and is expected to ...

Construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production ...