IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

CAMBRIDGE, England--(BUSINESS WIRE)--Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics ...

The new motor driver supports both sensor-based and sensorless control while aiding configuration with programmable flash.

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...

You can find a lot of strange things inside IC packages. For example, the Dallas DS12885 and DS12887 real time clock “chips” were available in a large package with an internal battery. The problem, of ...