Broadcom (AVGO), reportedly, is launching a new networking chip called Thor Ultra, and separately the company unveiled its Wi ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

From Catalog ICs to Custom ICs and Security IP, a unified offering to shape the post-quantum era. SEALSQ Corp (NASDAQ: LAES), ...

Synopsys' AI-driven EDA tools and recent acquisitions like ANSYS are fueling adoption, but competition and lowered earnings ...

Additionally, Selangor's IC Design Park, touted as the largest in Southeast Asia, is set to become operational in July 2024. Malaysia has also unveiled its National Semiconductor Strategy (NSS), ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.